Logic/memory, MEMS, Photovoltaic, IC substrate (ICS), Panel-level packaging, PCB, Solar, HDD
Chemistry Process Control
KLA’s chemistry process control products support multiple applications for advanced packaging manufacturing, including analysis and monitoring of wet chemicals used in wafer-level packaging (WLP), panel-level packaging (PLP), and IC substrates. From analysis systems for development of packaging technologies to turn-key solutions for fully automated online chemical monitoring, our products help engineers control advanced packaging processes. The information produced by our chemistry process control systems allows packaging manufacturers to quickly optimize processes and achieve higher yield and reliability.
Quali-Fill® Libra®
Online Chemical Management System for Plating
The Quali-Fill® Libra® system is a standalone metrology analyzer for electroplating and electroless deposition, for semiconductor advanced packaging, solar and hard disk drive manufacturing. The modular system supports the chemical metrology performance required for ultra-safe and ultra-clean wafer and panel fabrication by accurate analysis of main bath components and detecting and quantifying contaminants like photoresist, additive breakdown products and trace foreign metals. It meets all semiconductor safety and communications guidelines while monitoring plating chemicals used for wafer-level and panel-level packaging processes. The addition of Quali-Fill® Libra® KT100 provides elemental composition details from inductively coupled plasma optical emission spectroscopy (ICP-OES) for the most detailed breakdown. Paired with Quali-Dose®, it provides users with closed-loop, flexible, precise dosing to manage the quality of plated products.
Through-silicon via (TSV), Redistribution layer (RDL), Under bump metallization (UBM) and Micro bumping for Cu, Ni, SnAg and Au, Desmear, Eless prep, Electroless metallization for Cu, Pd, Ni, Au
Quali-Fill® Libra® KT100
Online chemical management of metal contaminants in ppb/ppm level using ICP-OES.
Quali-Dose®
Standalone dosing system with multiple dosing schemes for plating bath control.
QualiSurf®
Online Chemical Monitoring System for Wet Etch/Clean Chemistries in Advanced Packaging
The QualiSurf® chemical monitoring system supports advanced cleaning and wet etching applications in advanced wafer-level and panel-level packaging processes to minimize waste from non-optimal chemistries. Formulated for both chemical components, and etched products or process contaminants (for reclaimed chemicals), it provides powerful insights based on more than 15 integrated analytical methods, including spectral, electrochemical and titration methods. The QualiSurf online metrology system precisely monitors and controls each packaging manufacturing process and chemistry, with high accuracy and repeatability, ensured by auto calibration, validation and a self-analyzer health check.
Under bump metallization (UBM) etch for Cu, Sn, Ti or TiW, Photoresist (PR) removal
QualiSurf® W100 Series
Online metrology to analyze under bump metallization (UBM) etch to reclaim or reuse chemicals without quality issues.
QualiSurf® W200 Series
Online metrology to analyze photoresist (PR) removal to reclaim or reuse chemicals without quality issues.
The QualiLab Elite® benchtop lab instruments support chemistry analysis for evolving industry technologies and university applications.
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